Home | Tarapath | Low Pressure Moulding

Innovative Encapsulation

An alternative to potting, conformal coating and injection moulding

Read more

Comprehensive Part & Tool Design

Scale prototype tooling through to multi-cavity production tooling

Read more

A Green Alternative

Low Pressure Moulding is an innovative process designed to protect your electronics from environmental factors such as moisture, dust, vibration and handling.

How can Low Pressure Moulding can improve my product?

Think of the '4R approach':

icon lpm replace

Replace

Replace traditional potting, sealing and conformal coating which can be costly.

Read more

icon lpm reduce

Reduce

Reduce material, cycle time, equipment and operations footprint.

Read more

icon lpm reuse

Reuse

Re-use, recycle and reconsider the effect of your product on the environment.

Read more

icon lpm rethink

Rethink

The Low Pressure Moulding process allows designers and engineers greater flexibility when designing products when compared to housing electronics in enclosures.

Low Pressure Moulding allows the encapsulation to be the enclosure meaning graphics and surface treatments can be moulded directly onto the surface of the part.

With Low Pressure Moulding, there is no need to compromise.

Read more

A Simple Solution for Safe Protection

When you replace traditional electronics potting with the Low Pressure Moulding Process you are replacing up to 8 steps with 3 simple steps.

tarapath lpm process step1

STEP 1

Insert electronics

Insert parts directly into the mouldset.

tarapath lpm process step2

STEP 2

Mould

30 sec – 2 min encapsulation process.

tarapath lpm process step3

STEP 3

Test device

Parts handled immediately after moulding.

Equipment Matters

Tarapath offer both Optimel and LPMS low pressure moulding equipment, along with other peripheral requirements such as chillers, dryers and auto-feed systems.

Material Selection

Choose the right Henkel TECHNOMELT material for your application

Material selector

technomelt material

Product examples

Low Pressure Moulded products extend across a variety of applications catering for a diverse array of industry sectors.

Strain relief Seal

Strain Relief Seal

Cable Moulding

Fibre Optic Plug

Fibre Optic Plug

Cable Moulding

Temp Sensor

Temperature Sensor

Cable Moulding

Microswitches

Microswitches

Electronics Encapsulation

Optical Sensor

Optical Sensor

Electronics Encapsulation

Junction Ground Plate

Junction Ground Plate

Cable Moulding

Stepper Motor Cont

Stepper Motor Controller

Electronics Encapsulation

IR sensor mod

IR Sensor Module

Electronics Encapsulation

Grommet

Grommet

Cable Moulding

Sensor

Sensor

Electronics Encapsulation

Fibre Optic

Fibre Optic

Cable Moulding

Waterproofing plug

Waterproof plug

Cable Moulding

Relay board

Relay Board

Electronics Encapsulation

Overmoulded PCB3

Overmoulded PCB

Electronics Encapsulation

Custom Grommet

Custom Grommet

Cable Moulding

Wire Positioning

Wave Soldering Wire Positioning

Cable Moulding

Overmoulded PCB2

Overmoulded PCB

Electronics Encapsulation

Cable Support

Cable Support

Cable Moulding

Solenoid Coil

Solenoid Coil

Cable Moulding

Overmoulded PCB

Overmoulded PCB

Electronics Encapsulation

Flexible PCB wiring

Flexible PCB Wiring

Cable Moulding

Strain relief

Strain Relief

Cable Moulding

Overmoulded PCB4

Overmoulded PCB

Electronics Encapsulation

Question?

Let us assess your product and see if Low Pressure Moulding is the solution you’ve been looking for.